QC Experience Tips of Anti-counterfeit

Visual Inspection

Check the packaging condition,Outer labels,carrier tape/trays.

The actual devices will be inspected for correct markings, country of origin, datecodes, blacktopping, contamination, lead defects, tool/sand markings, logo markings, and construction defects.
These tests will tell if the components are NEW and Original from remarked

Decapsulation

This can further prove or disprove the authenticity of ICs.
It checks whether the die has been re-assembled or re-packaged or to verify whether a gross functional failure during IC test has been generated by physical damage or overstress.